TE Connectivity 2199337-5 | MICRO SIM MEMORY CARD CONNECTOR

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8538.90.81.80

SVHC

Yes

Automotive

No

PPAP

No

Terminal Pitch (mm)

2.54

Termination Method

Solder

Body Orientation

Straight

Maximum Current Rating (A)

1/Contact

Minimum Operating Temperature (°C)

-30

Maximum Operating Temperature (°C)

85

Mating Cycle (Cycles)

5000

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Micro SIM Card

Number of Rows

1

Gender

RCP

Number of Contacts

8